Tue, 10/01/2012 - 16:33
Xilinx, Inc. has launched its first Zynq-7000 Extensible Processing Platform (EPP), which the company touts as a major milestone in the roll-out of a complete embedded processing platform that for the first time offers developers ASIC levels of performance and power consumption, the flexibility of an FPGA and the programmability of a microprocessor. Customers who have developed systems using the...
Thu, 05/01/2012 - 16:33
Caroline Ross, MIT: “Diode for Light - Important step toward computing with light
Research at MIT produces long-sought component to allow complete optical circuits on silicon chips.
November 25, 2011
There has been enormous progress in recent years toward the development of photonic chips — devices that use light beams instead of electrons to carry out their computational tasks. Now,...
Tue, 20/12/2011 - 15:04
Three-dimensional chip stacks are better connected with through-silicon-vias (TSVs) filled with carbon nanotubes instead of copper, according to researchers at Chalmers University of Technology in Gothenburg, Sweden.
Tue, 06/12/2011 - 08:28
Thanks to a new screen made of fog, a 3D rabbit can appear in mid-air like a ghostly apparition. Developed by Masataka Imura of Osaka University in Japan and his team, the display allows people to move around it and view the 3D projection from different angles.
Tue, 22/11/2011 - 13:41
In cooperation with Testonica, Goepel electronic developed the ChipVORX model library series, structured modularly as intelligent IP for FPGA accelerated in-system programming (ISP) of Flash components. The models enable the ultra-fast in-system programming of every kind of Flash components at full workflow automation.