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Department of IT (DIT) Renamed Department of Electronics & IT (DeitY)
Department of IT (DIT) Renamed Department of Electronics & IT (DeitY)
200 Electronic Manufacturing Clusters by 2020, to Employ Around 28 Million People: Sibal
Source: http://www.pib.nic.in/newsite/erelease.aspx?relid=82378
On Semi, Qualcomm, Infineon shine in chip rankings
LONDON – Boosted by its acquisition of Sanyo's semiconductor business, On Semiconductor registered a 49 percent sales increase in 2011 and moved into the top 25 chip companies, according to a ranking of companies by 2011 chip sales compiled by market research company IC Insights.
Teardown slideshow: Inside the third-generation iPad
(Dylan McGrath) - The third generation of Apple Inc.'s wildly successful iPad media tablet, which hit store shelves this week, features a modified version of Apple's A5 processor, A5X, which has a larger floorplan to include quad-core graphics, according to a teardown analysis performed by UBM TechInsights.
Xilinx Ships First Zynq-7000 Devices, the World's First Extensible Processing Platform
Xilinx, Inc. has launched its first Zynq-7000 Extensible Processing Platform (EPP), which the company touts as a major milestone in the roll-out of a complete embedded processing platform that for the first time offers developers ASIC levels of performance and power consumption, the flexibility of an FPGA and the programmability of a microprocessor. Customers who have developed systems using the Zynq-7000 EPP emulation platform, early access Xilinx hardware tools, and standard software tools supported by the ARM Connected Community are now migrating their applications to these first devices and beginning the next stages of their product development.
Diode for Light - Important step toward computing with light
Caroline Ross, MIT: “Diode for Light - Important step toward computing with light Research at MIT produces long-sought component to allow complete optical circuits on silicon chips. November 25, 2011 There has been enormous progress in recent years toward the development of photonic chips — devices that use light beams instead of electrons to carry out their computational tasks. Now, researchers at MIT have filled in a crucial piece of the puzzle that could enable the creation of photonic chips on the standard silicon material that forms the basis for most of today’s electronics.
Carbon better than copper for TSVs
Three-dimensional chip stacks are better connected with through-silicon-vias (TSVs) filled with carbon nanotubes instead of copper, according to researchers at Chalmers University of Technology in Gothenburg, Sweden.
Video: Mist screens enable 3D projection - research
Thanks to a new screen made of fog, a 3D rabbit can appear in mid-air like a ghostly apparition. Developed by Masataka Imura of Osaka University in Japan and his team, the display allows people to move around it and view the 3D projection from different angles.
FPGA embedded intelligent IP enables ultra-fast Flash programming
In cooperation with Testonica, Goepel electronic developed the ChipVORX model library series, structured modularly as intelligent IP for FPGA accelerated in-system programming (ISP) of Flash components. The models enable the ultra-fast in-system programming of every kind of Flash components at full workflow automation.
Dual-interface memory uses energy harvesting for battery-free design
STMicroelectronics (NYSE: STM) has extended its family of RFID/NFC wireless memory ICs with the M24LR16E, a 16-Kbit device that can also harvest enough energy to enable small electronic items using it to become completely battery-free electronic applications.
C++11 improvements over C++03
C++11 aka C++0x is the new standard of the C++ language, published in late 2011. It supersedes the older C++03 standard, which was published in 2003. Naturally, it brings improvements over the old standard, some of which this article will outline.
